Highly active microsilica epoxy plastic sealer

Highly active microsilica epoxy plastic sealer:This type of silica fume is commonly used in electronics.Purity. highly active micro silicon powder is the most basic requirements of electronic products on the material, in the ultra-large-scale integrated circuits, the requirements are even more stringent, in addition to the conventional impurity element content requirements of low, but also requires the radioactive element content as low as possible or no. With the progress of the process, the electronics industry on the purity of silicon micropowder requirements are increasingly high. Particle size and uniformity. Ultra-large-scale integrated circuit packaging materials require fine particle size, narrow distribution range, good uniformity of silicon powder. The particle size of silicon micropowder used for epoxy plastic sealing material in the United States is generally 1-3μm, and the average particle size in Japan is generally 3-8μm. Due to the better thermal conductivity of sm…