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Uniform Lead Frame Arrangement IC Lead Frame

Uniform Lead Frame Arrangement IC Lead Frame Application: IC Lead Frame, IC Chip Carrier Product features: lead frame arrangement is uniform. etching line is straight. half etching surface is smooth and delicate, high precision. Material: C192/C194 copper, thickness: 0.125mm- 0.25mm Manufacturing capacity: minimum diameter :0.05mm minimum distance :0.18 mm-0.3mm accuracy :±0.02 mm-±0.04 mm

SHAOXING HUALI ELECTRONICS CO., LTD.

Website:

www.cnsxhuali.com

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